Chinese chip startup SUNMMIO technology raised $280M over the past year. It recently closed a Series A round led by Beijing’s state-backed investor Yizhuang Guotou, alongside other municipal and district state capital platforms.
SUNMMIO designs and mass-produces 3D architecture AI chips for cloud computing. The funding will be used to expand its research team, advance its core technology, and to move its self-developed 3D TokenPU inference chip towards volume production.
The company is targeting a “trillion-level large model inference market.” Its first-generation product, the A4E, was taped out in June and stacks eight layers of memory wafers on a logic wafer via 3D hybrid bonding to reach 16TB/s memory bandwidth and bypass the “memory wall.”
Over the past year, SUNMMIO has raised funding from state platforms including CDB Capital and Zhongguancun Science City, through market firms such as Source Code Capital and Jade Value Capital, and Industry funds including Legend Capital. Some have reinvested.
Before the funding, core team members spent nearly 7 years in 3D IC technology. They have established a wafer-on-wafer hybrid bonding supply chain in mainland China, achieved mass production across tens of thousands of 3D IC wafers, and generated cumulative revenues exceeding US $165 million.
“The explosion of large-model inference is essentially an extreme test of compute energy efficiency; the company chose the 3D TokenPU architecture to bypass the traditional path of general-purpose GPUs,” said Wang Fuquan, Founder and Chief Executive Officer.
Back-to-back funding rounds led by state capital reflect China’s strategic push towards homegrown AI computing powered by domestic manufacturing and supply chains. As inference workloads scale up, investors are backing chip developers that favour energy-efficient architectures over traditional general-purpose power.
